MULTICOMP
芯片和元件插座, 2227系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
MULTICOMP
芯片和元件插座, 2227MC系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
MULTICOMP
芯片插座, DIP, 触点数:40, 排距:0.3''
3M
芯片插座, DIP40, 宽0.6英寸
TE CONNECTIVITY
芯片和元件插座, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
MILL MAX
芯片插座, DIP, 40路
MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
MULTICOMP
芯片和元件插座, ICD Series, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
ARIES
芯片和元件插座, X55X系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
MILL MAX
芯片插座, DIP-40, 通孔安装
MILL MAX
芯片插座, DIP, 40路
TE CONNECTIVITY
芯片插座, DIP, 触点数:40, 排距:0.6''
MILL MAX
芯片插座, DIP, 40路, 通孔安装
AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
HARWIN
芯片和元件插座, D28系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
HARWIN
芯片和元件插座, D95系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
ARIES
芯片和元件插座, 518系列, DIP, 40 触点, 2.54 mm, 7.62 mm, 镀金触芯
AMP - TE CONNECTIVITY
芯片插座, DIP, 触点数:40, 排距:0.6''
MULTICOMP
芯片插座, DIP, 触点数:40, 1A
MILL MAX
芯片插座, DIP, 40路, 通孔安装
MULTICOMP
芯片插座, DIP, 触点数:40, 排距:0.3'', 1A
MILL MAX
芯片插座, DIP, 40路, 通孔安装
ARIES
芯片和元件插座, 518系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
3M
芯片和元件插座, 4800 Series, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯