LAIRD TECHNOLOGIES
热绝缘, 导热界面, 12" x 18", 玻璃纤维 / 硅橡胶, 6 kV, 0.23 mm, 1000000 Mohm-m, 1.17 °C/W
BERGQUIST
热绝缘, Bond-Ply 100, .005", 6" x 6"板, 碳, 0.8 W/m.K, 3000 V, 0.127 mm, 100000000000 ohm-m
BERGQUIST
热绝缘, .125", 4" x 4"板, 缝隙垫 2500 S80, 2.7 W/m.K, 6000 V, 3.18 mm, 100000 Mohm-m, 0.74 °C/W
RICHCO
热绝缘, 盖, 高温, TO-220, 25个, 碳
BERGQUIST
热绝缘, .040", 4" x 4"板, 缝隙垫 VOUS, 1 W/m.K, 6 kV, 1.016 mm, 10 ohm-m
BERGQUIST
热绝缘, .040", 4" x 4"板, 缝隙垫 3000 S30, 3 W/m.K, 2.5 kV, 1.016 mm, 85000 Mohm-m, 0.66 °C/W
PANASONIC ELECTRONIC COMPONENTS
石墨导热片
AMEC THERMASOL
薄膜, 不含硅树脂, 6.0W/MK, 0.09K/W, 片装
BERGQUIST
热绝缘, 缝隙垫, VO超软, .080" 8" x 16", 1 W/m.K, 6 kV, 2.032 mm, 100000 Mohm-m
BERGQUIST
热绝缘, 缝隙垫 VO, .160", 片, 缝隙垫 VO, 0.8 W/m.K, 6 kV, 4.1 mm, 100000 Mohm-m
BERGQUIST
热绝缘, 缝隙垫, 5000S35 .060" 8x16" 片, 5 W/m.K, 1.524 mm, 1000 Mohm-m, 1.15 °C/W
T GLOBAL
空隙填充导热垫, 1X150MM 方形
T GLOBAL
空隙填充导热垫, 0.5MM 片状
AMEC THERMASOL
导热胶带, 0.85W/M.K
T GLOBAL
热绝缘, 缝隙填充, 150mm方形, 4 W/m.K, 1 mm
BERGQUIST
热绝缘, Sil-垫 900S .009", 12" x 12"片, 1.6 W/m.K, 5.5 VAC, 0.229 mm, 10000 Mohm-m
T GLOBAL
热绝缘, 缝隙填充, 面板, 2.2 W/m.K, 2 mm
AMEC THERMASOL
薄膜, 不含硅树脂, 6.0W/MK, 0.09K/W, 片装
LAIRD TECHNOLOGIES
热绝缘, 导热界面, 11" x 18", PI 聚酰亚胺薄膜, 6 kV, 0.076 mm, 100000000 Mohm-m
AMEC THERMASOL
热绝缘, 填充垫, 3W/MK, 20支撑 00, 1.0mm, 硅橡胶, 3.15 W/m.K, 1 mm, 0.402 °C/W
RICHCO
热绝缘, 盖, IEC, TO-220, 25个, 尼龙 (聚酰胺), 玻璃填充, 3.7 mm
MULTICOMP
TRANSISTOR PAD, TO-5, PK1000
MULTICOMP
热绝缘, 绝缘套件, Mica, 2KV, TO-3, 云母, 2 kV, 0.2 mm
BERGQUIST
热绝缘, 缝隙垫, 5000S35 .100" 4" x 4" 片, 5 W/m.K, 2.54 mm, 1000 Mohm-m
NTE ELECTRONICS
导热垫, 0.009英寸, 4.5KV, TO-220