WOLFSON MICROELECTRONICS
芯片, MEMS麦克风, SNR 58DB, LGA-4
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, SPI, 数字式, ± 2°C, -55 °C, 125 °C, μMAX, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 3°C, -55 °C, 125 °C, NSOIC, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 低电压, 数字式, ± 2°C, -55 °C, 125 °C, NSOIC, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 6°C, -270 °C, 1372 °C, TDFN, 10 引脚
MAXIM INTEGRATED PRODUCTS
温度计/恒温器, 数字, 9/12位, 8UMAX
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 串行控制, 数字式, ± 2°C, -55 °C, 125 °C, TO-92, 3 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 0.7°C, -55 °C, 150 °C, TDFN, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 0.5°C, -55 °C, +125 °C, SOIC, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 4°C, -210 °C, 1200 °C, TDFN, 10 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 串行, 数字式, ± 2°C, -55 °C, 125 °C, μMAX, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 4°C, -270 °C, 400 °C, TDFN, 10 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 2°C, -55 °C, 125 °C, μMAX, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 电压, ± 2°C, -55 °C, +125 °C, μSOP, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 7°C, -270 °C, 1768 °C, TDFN, 10 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 低电压, 数字式, ± 2°C, -55 °C, 125 °C, μSOP, 8 引脚
MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 串行控制, 数字式, ± 2°C, -55 °C, 125 °C, TO-92, 3 引脚
SILICON LABS
芯片, 接近/环境光传感器, ODFN-8
SILICON LABS
芯片, 接近/环境光传感器, ODFN-8
HOPERF
+10dBm Transmitter module - 433Mhz
HOPERF
+10dBm Transmitter module - 868Mhz
HOPERF
+17dBm Transmitter module - 433Mhz
HOPERF
+17dBm Transmitter module - 868Mhz
HOPERF
射频收发器模块, 433MHZ, 13DBM
HOPERF
收发器, 868MHZ, FSK/OOK