MULTICOMP

圆形螺纹垫片

NXP

Tower System Module for Kinetis KV1x Family of Microcontrollers

TEXAS INSTRUMENTS

/t工作台

TEXAS INSTRUMENTS

评估模块, TPS3301-061

NXP

RF Tower System Module for Wireless Modular Reference Boards

NXP

Reference Board, 5W Low Power Wireless Charger Transmitter

MULTICOMP

轻触开关, 不发光, 190 gf, 12 V, 50 mA, SMD

MULTICOMP

轻触开关, 不发光, 190 gf, 12 V, 50 mA, SMD

WAKEFIELD SOLUTIONS

散热器, TO-220

MOLEX

连接器, 母, 1路, 1排

MOLEX

连接器, USB, USB A, USB 3.0, 插座, 9 路, 通孔安装, 垂直

MOLEX

线至板连接器, Lite-Trap 104188系列, 2 触点, 插座, 4 mm, 表面安装　, 1 排

MOLEX

连接器, USB, USB A, USB 3.0, 插座, 9 路, 通孔安装, 直角型

AMPHENOL

连接器, D sub, 堆叠式, SD系列, DE, 插座, 9 触点, 钢主体, 焊接

MOLEX

连接器, 母, 2路, 1排, 4MM

AMPHENOL

15 Way High Density D Sub Socket, Solder Bucket Termination, Gold Flash Tinned Shell, 5A

AMPHENOL

连接器, D sub, 堆叠式, 17D系列, DE, 插座, 9 触点, 钢主体, IDC / IDT

MOLEX

连接器, USB 3.0 A, 母, 18触点, 通孔垂直安装

SOURIAU

矩形电源连接器, Qikmate系列, 通孔安装, 插头, 6 触点, 5.08 mm, 公

AMPHENOL

连接器, D sub, 堆叠式, 17D系列, DB, 插座, 25 触点, 钢主体, IDC / IDT

AMPHENOL

连接器, D sub, 堆叠式, 高密, HD系列, DE, 插头, 15 触点, 钢主体, 焊接

AMPHENOL

26 Way High Density D Sub Socket, Straight PCB Termination, 0.4μm Tinned Shell, 5A

MILL MAX

压接接线端子, 塔式, 12.725MM

AMPHENOL

连接器, D sub, 堆叠式, DF系列, DE, 插头, 9 触点, 钢主体, 通孔安装

MULTICOMP

射频/同轴连接器, SMB同轴, 直型插头, 焊接, 50 ohm, RG174, 铍铜