NXP

PowerQUICC III MPC8536 Android开发套件 用于Android OS评估

NXP

Development System for MPC8536E PowerQUICC III Processor

NXP

评估板, CAN, LIN, PHY, 电源架构, 音频扬声器

NXP

Evaluation Kit for Qorivva MPC5554

NXP

Evaluation Board for Qorivva MPC5604E Microcontroller

NXP

评估套件, MPC564XA, 176LQFP

NXP

Evaluation Kit for MPC8306 PowerQUICC II Pro Processor

NXP

评估板, 网络智能网关

NXP

Evaluation Kit for MPC8309 PowerQUICC II Pro Processor

NXP

PowerQUICC II Pro MPC8315E Reference Development Board Rev1.2 with Socket

AMEC THERMASOL

散热器, 方形, Micro Porous, 10.21 °C/W, 2 mm, 10 mm, 10 mm

AMEC THERMASOL

散热器, 方形, Micro Porous, 10.21 °C/W, 2 mm, 15 mm, 15 mm

AMEC THERMASOL

散热器, 方形, Micro Porous, 10.21 °C/W, 2.5 mm, 22 mm, 22 mm

AMEC THERMASOL

散热器, 方形, Micro Porous, 10.21 °C/W, 2.5 mm, 20 mm, 20 mm

AMEC THERMASOL

散热器, 方形, Micro Porous, 10.21 °C/W, 2.5 mm, 25 mm, 25 mm

AMEC THERMASOL

散热器, 方形, Micro Porous, LED, 10.21 °C/W, 2.5 mm, 40 mm, 40 mm

AMEC THERMASOL

散热器, 方形, Micro Porous, LED, 10.21 °C/W, 2.5 mm, 30 mm, 30 mm

AMEC THERMASOL

散热器, 方形, Micro Porous, LED, 10.21 °C/W, 5 mm, 30 mm, 30 mm

AMEC THERMASOL

热绝缘, 相变材料, 蜡, 4 W/m.K, 0.25 mm

AMEC THERMASOL

散热器, LED, 10.21 °C/W, 5 mm, 30 mm, 30 mm

AMEC THERMASOL

热绝缘, 相变材料, 聚合物弹性体, 石墨填充, 5 W/m.K, 0.13 mm

MULTICOMP

接线端子块, 插入式, 3路, 36-12AWG

CGS - TE CONNECTIVITY

通孔电阻器, MPC系列, 50 ohm, 5 W, ± 5%, 300 V, TO-220

CGS - TE CONNECTIVITY

通孔电阻器, MPC系列, 10 ohm, 5 W, ± 5%, 300 V, TO-220

CGS - TE CONNECTIVITY

通孔电阻器, MPC系列, 100 ohm, 5 W, ± 5%, 300 V, 径向引线