EMULATION TECHNOLOGY
芯片适配器, 20-TSSOP至20-DIP
ROTH ELEKTRONIK
芯片适配器, 玻璃纤维, QFP-32
ROTH ELEKTRONIK
芯片适配器, 玻璃纤维, QFN-24
ARIES
适配器, 低成本, TSOP32至DIP
AMPHENOL FCI
插座, DIP-28, 通孔安装
MULTICOMP
芯片和元件插座, 2227系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
3M
插座, DIP, 28路, 通孔安装
AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP插座, 28 触点, 2.54 mm, 15.24 mm, 镀金触芯
AMPHENOL FCI
芯片插座, DIP, 32路, 通孔安装
MULTICOMP
芯片和元件插座, 2227MC系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
MULTICOMP
芯片插座, DIP, 触点数:40, 排距:0.3''
3M
插座, DIP, 28路, 通孔
AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP, 24 触点, 2.54 mm, 15.24 mm, 镀金触芯
3M
芯片插座, DIP40, 宽0.6英寸
MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 32 触点, 2.54 mm, 15.24 mm, 镀锡触芯
MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 24 触点, 2.54 mm, 15.24 mm, 镀锡触芯
3M
芯片插座, DIP-24
MILL MAX
芯片插座, DIP, 28路, 通孔安装
MILL MAX
芯片插座, DIP, 32路, 通孔安装
MULTICOMP
芯片插座, DIP, 触点数:24, 排距:0.3''