PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 92 mm
PANASONIC ELECTRONIC COMPONENTS
热绝缘, NASBIS袋型, 0.026 W/m.K, 100 μm
PANASONIC ELECTRONIC COMPONENTS
热绝缘, PGS复合型, 0.026 W/m.K, 500 μm
PANASONIC ELECTRONIC COMPONENTS
热绝缘, PGS复合型, 0.026 W/m.K, 1 mm
PANASONIC ELECTRONIC COMPONENTS
热绝缘, NASBIS袋型, 0.026 W/m.K, 500 μm
BERGQUIST
热绝缘, 导热界面, Sheet, 缝隙垫 VO, 0.8 W/m.K, 6 kV, 3.175 mm, 100000 Mohm-m
BERGQUIST
热绝缘, .125", 4" x 4"板, 缝隙垫 3000 S30, 3 W/m.K, 2500 V, 3.175 mm, 85000 Mohm-m
FISCHER ELEKTRONIK
热绝缘, 导热铝箔, 粘合剂, 尼龙(聚酰胺), (PI聚酰亚胺薄膜), 0.37 W/m.K, 0.127 mm
PANASONIC ELECTRONIC COMPONENTS
热绝缘, PGS复合型, 0.026 W/m.K, 1 mm
BERGQUIST
热绝缘, Sil-垫 900S, .009", TO-3P, 10只, 玻璃纤维 / 硅橡胶, 1.6 W/m.K, 5.5 VAC, 228.6 μm, 10 ohm-m, 0.95 °C/W
LAIRD TECHNOLOGIES
热绝缘, 导热界面, 11.75" x 18", 玻璃纤维 / 硅橡胶, 6 kV, 0.23 mm, 1000000 Mohm-m, 1.17 °C/W
BERGQUIST
热绝缘, 缝隙垫 VO软性, .125", 片, 缝隙垫VO 软, 0.8 W/m.K, 6 kV, 3.2 mm, 100000 Mohm-m
T GLOBAL
高导热石墨垫, 0.5MM
T GLOBAL
空隙填充导热垫, 1.5MM 片状
T GLOBAL
高导热石墨垫, 0.13MM
BERGQUIST
热绝缘, Sil-垫 2000, .015", 6"x6"片, 玻璃纤维/有机硅弹性体, 3.5 W/m.K, 4 kV, 0.38 mm, 10 ohm-m, 0.57 °C/W
PANASONIC ELECTRONIC COMPONENTS
热绝缘, PGS复合型, 0.026 W/m.K, 1 mm