PAN1311/1321 in comparison to the pin compatible HCI solution (PAN1310/1320), a powerful host is no longer needed. The PAN1311/1321 is manufactured in a 15.6 x 8.7 x 2.8 mm3 SMD LGA package with shielded case and will be qualified to the Bluetooth 2.0 standard. Due to a very low price PAN1311/1321 is well suited for units produced in all quantities; with the simple AT command set, PAN1311/1321 can be easily integrated into your application. This module follows the national and international regulations, e.g. EMC, Safety, EN300328, FCC.
- PAN1321-SPP, with Antenna
- Complete Bluetooth 2.1 + EDR solution
- Supported Profiles: RFCOMM, SPP device A and B
- Ultra low power design
- No external components needed
- Integrates ARM7TDMI, RAM and patchable 256k EEPROM
- Low power clock from internal oscillator or external low power clock
工业, 自动化与过程控制, 建筑自动化, 传感与仪器, 射频通信
(EN)
