
AMP - TE CONNECTIVITY
芯片和元件插座, DIP插座, 18 触点, 2.54 mm, 7.62 mm, 镀锡触芯

MILL MAX
芯片插座, DIP, 18脚, 通孔安装

MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 18 触点, 2.54 mm, 7.62 mm, 镀锡触芯

AMP - TE CONNECTIVITY
芯片插座, DIP, 18路, 通孔安装

MILL MAX
插座, DIP, 18路, 通孔

ARIES
芯片和元件插座, 350000-11-RC系列, 适配器, 18 触点, 2.54 mm, 3.81 mm, 镀金触芯

TE CONNECTIVITY
芯片插座, DIP, 触点数:18, 排距:0.3''

AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP, 18 触点, 2.54 mm, 7.62 mm, 镀金触芯

MULTICOMP
芯片插座, DIP, 触点数:18, 排距:0.3'', 1A