产品分类：芯片插座,规格：节距 2.54mm,
MILL MAX
芯片插座, DIP, 16路
(EN)
AMP - TE CONNECTIVITY
连接器, SIP插座
(EN)
MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 20 触点, 2.54 mm, 7.62 mm, 镀锡触芯
(EN)MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)MILL MAX
芯片插座, DIP, 28脚, 通孔安装 直型
(EN)
HARWIN
芯片和元件插座, D01系列, SIP插座, 8 触点, 2.54 mm, 镀金触芯
(EN)
TE CONNECTIVITY
芯片插座, DIP, 触点数:28, 排距:0.6''
(EN)
MULTICOMP
芯片和元件插座, ICD Series, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
MULTICOMP
芯片和元件插座, MC-2227系列, DIP插座, 28 触点, 2.54 mm, 7.62 mm, 镀锡触芯
(EN)
AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP插座, 20 触点, 2.54 mm, 7.62 mm, 镀金触芯
MILL MAX
芯片插座, DIP, 20脚, 通孔安装
(EN)
MULTICOMP
芯片和元件插座, ICD Series, DIP插座, 20 触点, 2.54 mm, 7.62 mm, 镀锡触芯
(EN)
MILL MAX
芯片插座, DIP, 16路
(EN)
HARWIN
芯片和元件插座, D01系列, SIP插座, 100 触点, 2.54 mm, 镀金触芯
(EN)
ARIES
芯片和元件插座, X55X系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
MULTICOMP
芯片插座, DIP, 触点数:20, 排距:0.3'', 1A
(EN)MILL MAX
芯片插座, DIP, 18脚, 通孔安装
(EN)MULTICOMP
芯片和元件插座, 2227MC系列, DIP插座, 28 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
MILL MAX
芯片插座, DIP, 24路, 通孔安装
(EN)MILL MAX
插座, DIP, 14路, 通孔
(EN)
MULTICOMP
芯片和元件插座, ICD Series, DIP插座, 6 触点, 2.54 mm, 7.62 mm, 镀锡触芯
(EN)
MULTICOMP
芯片插座, DIP, 16路
(EN)
AMP - TE CONNECTIVITY
插座, DIP, 32路, 通孔安装
(EN)
MILL MAX
芯片插座, DIP, 20路, 通孔安装
(EN)MILL MAX
芯片插座, DIP-18, 通孔安装
(EN)
