产品分类：芯片插座,搜索词：11.,
MILL MAX
芯片和元件插座, 110 Series, DIP插座, 8 触点, 2.54 mm, 7.62 mm, 镀金触芯
(EN)
MILL MAX
芯片插座, DIP, 16路, 通孔安装
(EN)
MULTICOMP
芯片和元件插座, MC-2227系列, DIP插座, 28 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
MILL MAX
芯片插座, DIP, 24路, 通孔安装 直型
(EN)MILL MAX
芯片插座, DIP, 14路, 通孔安装
(EN)
MULTICOMP
芯片插座, DIP, 触点数:16, 排距:0.3''
(EN)
ARIES
芯片和元件插座, 518系列, DIP, 16 触点, 2.54 mm, 7.62 mm, 镀金触芯
(EN)
MULTICOMP
芯片插座, DIP, 触点数:40, 1A
(EN)
MULTICOMP
芯片插座, DIP, 触点数:40, 排距:0.3'', 1A
(EN)
MILL MAX
芯片插座, DIP, 20脚, 通孔安装
(EN)MILL MAX
芯片插座, DIP, 18路, 通孔安装
(EN)MILL MAX
芯片插座, DIP, 40路, 通孔安装
(EN)
ARIES
芯片和元件插座, X55X系列, DIP, 28 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
MULTICOMP
芯片插座, DIP, 触点数:48, 排距:0.6''
(EN)MILL MAX
连接器, 芯片插座, DIP, 8路, 电路板
(EN)ARIES
芯片和元件插座, X55X系列, DIP插座, 48 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
ARIES
芯片和元件插座, DIP插座, 14 触点, 2.54 mm, 7.62 mm, 镀锡触芯
(EN)
AMP - TE CONNECTIVITY
芯片插座, DIP, 触点数:28, 排距:0.61''
(EN)
MULTICOMP
芯片插座, DIP, 触点数:40, 排距:0.3'', 1A
(EN)
ARIES
芯片和元件插座, EJECT-A-DIP系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
(EN)ARIES
芯片和元件插座, 518系列, DIP, 14 触点, 2.54 mm, 7.62 mm, 镀金触芯
(EN)
MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 24 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
MULTICOMP
芯片插座, DIP, 触点数:18, 排距:0.3'', 1A
(EN)
MULTICOMP
芯片插座, DIP, 触点数:24, 1A
(EN)
