产品分类：热介面材料,
PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 120 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 128 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 136 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 150 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 163 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 186 mm
(EN)
AMEC THERMASOL
导热胶带, 0.85W/M.K
(EN)
BERGQUIST
热绝缘, Sil-垫 900S .009", 12" x 12"片, 1.6 W/m.K, 5.5 VAC, 0.229 mm, 10000 Mohm-m
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 90 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 308 mm
(EN)
LAIRD TECHNOLOGIES
热绝缘, 导热界面, 11" x 18", PI 聚酰亚胺薄膜, 6 kV, 0.076 mm, 100000000 Mohm-m
(EN)
AMEC THERMASOL
热绝缘, 填充垫, 3W/MK, 20支撑 00, 1.0mm, 硅橡胶, 3.15 W/m.K, 1 mm, 0.402 °C/W
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 158 mm
(EN)
MULTICOMP
TRANSISTOR PAD, TO-5, PK1000
(EN)
