产品分类：热介面材料,
AMEC THERMASOL
热接口膜, 硅树脂
(EN)
BERGQUIST
热绝缘, Sil-垫 K-6, .006", 12" x 12"片, PI 聚酰亚胺薄膜, 1.1 W/m.K, 6000 V, 0.152 mm, 1000000 Mohm-m
(EN)
MCM
SEMICONDUCTOR ((NW))
LAIRD TECHNOLOGIES
热绝缘, 导热界面, 11.75" x 18", 玻璃纤维 / 硅橡胶, 6 kV, 0.23 mm, 1000000 Mohm-m, 1.29 °C/W
(EN)
AMEC THERMASOL
Thermal Adhesive Tape, 2.5 W/m.K, Acrylic, Fibreglass, 0.2 mm, 0.39 °C/W, 300 mm
(EN)
AMEC THERMASOL
热绝缘, 填充垫, +T1, 6 W/m.K, 0.5 mm, 0.167 °C/W
(EN)AMEC THERMASOL
热绝缘, 填充垫, 300x300mm, 6 W/m.K, 2 mm, 0.61 °C/W
(EN)AMEC THERMASOL
热绝缘, 填充垫, 3W/MK, 20支撑 00, 2.0mm, 硅橡胶, 3.15 W/m.K, 2 mm, 0.625 °C/W
(EN)AMEC THERMASOL
热绝缘, 填充垫+T1, 40支撑 00, 硅树脂, 5 W/m.K, 1 kV, 0.5 mm, 0.17 °C/W
(EN)
