
MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 1 μF, 50 V, VT, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 47 μF, 50 V, VT, V-Chip Series

VISHAY
表面贴装钽电容, TMCJ系列, 10 μF, ± 20%, 6.3 V, 0603 [1608 公制], J

MULTICOMP
多层陶瓷电容器, 表面贴装, MC系列, 3 pF, ± 0.25pF, C0G / NP0, 50 V, 0805 [2012 公制]