
MULTICOMP
多层陶瓷电容器, 表面贴装, 0805 [2012 公制], 100 pF, 25 V, ± 1%, C0G / NP0, MCMT Series

MULTICOMP
多层陶瓷电容器, 表面贴装, 1206 [3216 公制], 0.01 μF, 100 V, ± 10%, X7R, MCSH Series

MULTICOMP
多层陶瓷电容器, 表面贴装, 0603 [1608 公制], 0.022 μF, 25 V, ± 10%, X7R, MCT Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 22 μF, 16 V, VT, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 47 μF, 16 V, VT, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 22 μF, 6.3 V, VT, V-Chip Series

KEMET
铝电解电容, 摁入式, 1000 μF, 250 V, PEH532 系列, 1500 hours @ 105°C, ± 20%, 快速连接、卡入式

KEMET
膜电容, 0.22 μF, 50 V, PPS(聚亚苯基硫化物), ± 5%, SMC 系列, 2824 [7260公制]

KEMET
钽聚合物电容器, KO-CAP?, 100 μF, 10 V, T520 系列, ± 20%, B, 0.07 ohm

KEMET
钽聚合物电容器, KO-CAP?, 10 μF, 25 V, T521 系列, ± 20%, B, 0.1 ohm

KEMET
陶瓷抗干扰电容器, 470 pF, ERK610 系列, ± 20%, X1 / Y2, 440 V, 300 V

GENTEQ
电机启动电容