
LINEAR TECHNOLOGY
温度传感器芯片, 电压, 0°C 至 +0.5°C, 0 °C, +70 °C, DIP, 8 引脚

OPTEK TECHNOLOGY
透射光中断, 图腾柱型, 通孔安装, 3.18 mm, 1.27 mm, 40 mA, 2 V

SILICON LABS
温度传感器芯片, 数字式, ± 1°C, -40 °C, 125 °C, DFN, 6 引脚

TEXAS INSTRUMENTS
芯片, 温度传感器

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 串行控制, 数字式, ± 1°C, -55 °C, 150 °C, NSOIC, 8 引脚

SILICON LABS
温度传感器芯片, 数字式, ± 0.4°C, -40 °C, 85 °C, DFN, 6 引脚

NXP
压力传感器, 绝对, 12.1 mV/kPa, 20 kPa, 400 kPa, 4.64 V, 5.36 V

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 2°C, -50 °C, 1600 °C, NSOIC, 8 引脚

ANALOG DEVICES
温度传感器芯片, 数字式, ± 12%, -40 °C, +125 °C, QSOP, 16 引脚

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 2°C, -55 °C, +120 °C, SOIC, 8 引脚

SENSIRION
芯片, 温度传感器, +/- 0.3度, DFN-4

PANASONIC ELECTRONIC COMPONENTS
压力传感器, M封装, 0至50°C, 计量器, 0 kPa, 1 MPa

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 数字式, ± 2°C, -200 °C, 1300 °C, NSOIC, 8 引脚

OMRON ELECTRONIC COMPONENTS
透射光中断, 光晶体管, 通孔安装, 2 mm, 0.4 mm, 50 mA, 5 V

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, SMBus, 数字式, ± 1°C, -55 °C, 125 °C, QSOP, 16 引脚

PANASONIC ELECTRONIC COMPONENTS
压力传感器, L封装, 0至70°C, 计量器, 0 kPa, 6 kPa

ANALOG DEVICES
加速度计, MEMS, I2C, SPI, 数字, X, Y, Z, ± 0.5g, ± 1 g, ± 2 g, ± 4 g, 2 V, 3.6 V, LFCSP

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 2通道, 漏极开路, ± 1°C, 0 °C, 150 °C, TQFN, 16 引脚

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, SMBus, 漏极开路, ± 1°C, -40 °C, 125 °C, μMAX, 10 引脚

OPTEK TECHNOLOGY
光电开关, 槽型, 3.18MM, 集电极开路

OMRON ELECTRONIC COMPONENTS
透射光中断, 光晶体管, 通孔安装, 3 mm, 0.5 mm, 50 mA, 4 V