规格：时钟集成电路封装类型 MSOP,
MAXIM INTEGRATED PRODUCTS
芯片, 实时时钟, 串行, I2C, SMD, 1339, MSOP8
(EN)
MICROCHIP
芯片, 实时时钟/日历, I2C, 1K EE, 64B SRAM, 8MSOP
(EN)
MICROCHIP
芯片, 实时时钟/日历, GP I2C, 1KB EE 64B SRAM ID, 10MSOP
(EN)MICROCHIP
芯片, 实时时钟/日历, GP I2C, 1KB EE, 64B SRAM, 10MSOP
(EN)MICROCHIP
芯片, 实时时钟/日历, GP I2C, 64B SRAM, ID, 8MSOP
(EN)INTERSIL
芯片, 实时时钟带存储器, SRAM, 2B, MSOP-8
(EN)
INTERSIL
芯片, 实时时钟, D-D-M-Y, 8MSOP
(EN)MICROCHIP
芯片, 实时时钟, I2C, 64字节 SRAM, 8MSOP
(EN)MAXIM INTEGRATED PRODUCTS
芯片, 实时时钟, 串联, I2C, SMD, 1339, MSOP8
(EN)SILICON LABS
芯片, 时钟发生器, 压控晶体振荡器, 200MHZ, MSOP-10
(EN)MAXIM INTEGRATED PRODUCTS
IC, RTC, I2C, SMD, 1337, MSOP8
(EN)
ANALOG DEVICES
芯片, 时钟发生器, 带整数N分频锁相环, 500MHZ, MSOP-8
(EN)INTERSIL
芯片, 实时时钟, 低功率, 8字节 SRAM
(EN)MICROCHIP
芯片, 扇出缓冲器, 3GHZ, MSOP-8
(EN)MICREL SEMICONDUCTOR
芯片, 扇出缓冲器, 3GHZ, MSOP-8
(EN)
