规格：触点材料 磷青铜,
JST (JAPAN SOLDERLESS TERMINALS)
触芯, VH系列, 母, 压接, 18 AWG, 镀锡触芯, VH系列外壳
(EN)
MOLEX
触芯, Milli-Grid?, 50394系列, 母, 压接, 24 AWG, 镀金触芯, 51110 Milli-Grid Series Crimp Terminal Housings
(EN)
MOLEX
触芯, Pico-Clasp?, 501334系列, 母, 压接, 28 AWG, 镀锡触芯, 501330 Series Crimp Housing
(EN)
MOLEX
触芯, CMC CP密封混合, CMC, CP 64322系列, 母, 压接, 22 AWG, 镀锡触芯, CMC Connectors
(EN)
MOLEX
触芯, DuraClik™, Micro-Latch™, Mi II™, 50212系列, 母, 压接, 24 AWG, 镀锡触芯, 0.079" (2.00)间距及Mi II系统线至板压接外壳
(EN)
MOLEX
触芯, Pico-Clasp?, 501334系列, 母, 压接, 28 AWG, 镀锡触芯, 104050, 501330 Crimp Terminal Housings
(EN)
JST (JAPAN SOLDERLESS TERMINALS)
触芯, PH系列, 母, 压接, 22 AWG, 镀锡触芯, PAD Series 2mm Pitch Housing Connectors
(EN)
MOLEX
2.00mm Pitch Crimp Terminal 56134, Female, 22-26 AWG, Phosphor Bronze, 51242/51353/51382 Housings
(EN)
MOLEX
触芯, PicoBlade™, 50079系列, 母, 压接, 28 AWG, 镀锡触芯, PicoBlade Wire-to-Wire and Wire-to-Board Housings
(EN)
AMP - TE CONNECTIVITY
触芯, Micro Mate-N-Lok系列, 母, 压接, 26 AWG, 镀金触芯, Micro MATE-N-LOK Housings
(EN)
AMP - TE CONNECTIVITY
触芯, AMP EI系列, 母, 压接, 20 AWG, 镀锡触芯, Amp EI Series Connectors
(EN)
MOLEX
触芯, C-Grid?, 70021系列, 公, 压接, 22 AWG, 镀锡触芯, C-Grid / SL系列压接外壳连接器
(EN)
MOLEX
触芯, Micro-Fit 3.0?, 43030系列, 母, 压接, 26 AWG, 镀锡触芯, 43025, 43645, 44133
(EN)
MOLEX
触芯, Mini-Lock?, 50351系列, 母, 压接, 22 AWG, 镀锡触芯, 51102, 51163, 51103 Housing
(EN)
AMP - TE CONNECTIVITY
触芯, AMPMODU MOD V系列, 母, 压接, 20 AWG, 镀锡触芯, Mod V 系列连接器
(EN)
MOLEX
线至板连接器, Picoflex 90327系列, 10 触点, 插座, 1.27 mm, IDC / IDT, 2 排
(EN)
MULTICOMP
模块连接器, RJ11, 插头, 4 触点, 6 路, 1 端口
(EN)
MOLEX
线至板连接器, Picoflex 90327系列, 6 触点, 插座, 1.27 mm, IDC / IDT, 2 排
(EN)
MOLEX
触芯, KK? Trifurcon?, KK系列, 母, 压接, 22 AWG, 镀锡触芯, KK Series Crimp Housings
(EN)
