规格：触点镀层 镀金触芯,
AMP - TE CONNECTIVITY
板至板连接, 2.54 mm, 3 触点, 针座, AMPMODU MOD II系列, 通孔安装, 1 排
(EN)
ITT CANNON
D-SUB连接器, D*U Series D Sub Connectors, 母, 铜合金, 镀金触芯, 20 AWG, 24 AWG
(EN)
MOLEX
触芯, PanelMate?, PanelMate系列, 母, 压接, 28 AWG, 镀金触芯, PanelMate Wire-to-Board Housings
(EN)
MOLEX
触芯, Micro-Fit 3.0?, 43031系列, 公, 压接, 20 AWG, 镀金触芯, Micro-Fit 3.0 Connectors
(EN)
AMP - TE CONNECTIVITY
触芯, Mini-Universal Mate-N-Lok系列, 母, 压接 / 焊接, 18 AWG, 镀金触芯
(EN)
AMP - TE CONNECTIVITY
触芯, Mini-Universal Mate-N-Lok系列, 公, 压接, 18 AWG, 镀金触芯, AMP Mini-Universal MATE-N-LOK Series Housings
(EN)
MOLEX
触芯, C-Grid III?, 90119系列, 母, 压接, 22 AWG, 镀金触芯, C-Grid III系列模制压接端子外壳
(EN)
TE CONNECTIVITY
触芯, AMPMODU MTE系列, 公, 压接, 22 AWG, 镀金触芯, AMPMODU MTE Connectors
(EN)
JOHNSON - CINCH CONNECTIVITY
射频/同轴连接器, SMA同轴, 直型插座, 焊接, 50 ohm, 铍铜
(EN)
MOLEX
Pico-EZmate Wire-to-Board Header, Vertical, Housing Height: 1.55mm, with side-Friction Locks, 3 Way
(EN)
AMP - TE CONNECTIVITY
触芯, 多匹配, Type III+系列, 公, 压接, 18 AWG, 镀金触芯, Type III+ Series Connectors
(EN)
ITT CANNON
D-SUB连接器, D Sub Connectors, 公, 铜, 镀金触芯, 20 AWG, 24 AWG
(EN)
MOLEX
触芯, KK? 254, KK系列, 母, 压接, 22 AWG, 镀金触芯
(EN)
MOLEX
Micro-USB AB Receptacle, Right Angle, Top Mount, SMT, Lead-Free
(EN)
AMP - TE CONNECTIVITY
圆形连接器触点, 母, 18 AWG, 14 AWG, 压接, 镀金触芯, Multimate Type III+系列
(EN)
AMPHENOL
线至板连接器, 垂直, T821系列, 20 触点, 针座, 2.54 mm, 通孔安装, 2 排
(EN)
MULTICOMP
存储器插槽, 存储器插座, 9 触点, 磷青铜, 镀金触芯
(EN)
