规格：封装 每个,
ON SEMICONDUCTOR/FAIRCHILD
移位寄存器, 串行至并行, 1元件, DIP, 16 引脚, 2 V, 6 V
(EN)
ON SEMICONDUCTOR/FAIRCHILD
与门, HCT系列, 4门, 2输入, 4.8 mA, 4.5V至5.5V, SOIC-14
(EN)
ON SEMICONDUCTOR/FAIRCHILD
Buffer, 3-State, Non-Inverting, 4.5 V to 5.5 V, TSSOP-20
(EN)
STMICROELECTRONICS
芯片
(EN)
NXP
芯片, 电机驱动器, H桥, 24TSSOP
(EN)
BURR-BROWN
芯片, 16通道多路复用器 SP
(EN)
NXP
微控制器, 32位, AEC-Q100, 电源架构, 132 MHz, 2 MB, 64 KB, 416 引脚, BGA
(EN)
