规格：封装类型 DIP,
ON SEMICONDUCTOR
芯片, 74HC CMOS逻辑器件
(EN)
ON SEMICONDUCTOR
芯片, 74HC CMOS逻辑器件
(EN)
ON SEMICONDUCTOR
芯片, 74HC CMOS逻辑器件
(EN)ON SEMICONDUCTOR
芯片, 74HC CMOS逻辑器件
(EN)ON SEMICONDUCTOR
Latch, 74HC573, Transparent, Tri State, 30 ns, 7.8 mA, DIP
(EN)
ON SEMICONDUCTOR
反相器
(EN)ON SEMICONDUCTOR
芯片, 74HCT CMOS逻辑器件
(EN)ON SEMICONDUCTOR
逻辑芯片, CMOS, 六非门, 施密特, 74HCT14, 5.5V, DIP14
(EN)ON SEMICONDUCTOR/FAIRCHILD
移位寄存器, 串行至并行, 1元件, DIP, 14 引脚, 2 V, 6 V
(EN)ON SEMICONDUCTOR/FAIRCHILD
芯片, 74HC CMOS 逻辑 [ROHS Substitute: 1013915]
(EN)ON SEMICONDUCTOR/FAIRCHILD
移位寄存器, 串行至并行, 1元件, DIP, 16 引脚, 2 V, 6 V
(EN)NTE ELECTRONICS
芯片, 四路异或门, 2输入, DIP-14
(EN)
NXP
EEPROM, 2 Kbit, 256 x 8位, 100 kHz, I2C, DIP, 8 引脚
(EN)NXP
芯片, 混频器/放大器/振荡器
(EN)
TEXAS INSTRUMENTS
芯片, 译码器/信号分离器
(EN)TEXAS INSTRUMENTS
逻辑芯片, 寄存收发器, 24DIP
(EN)
