规格：封装类型 TSOP,
NEXPERIA
芯片, 解码器/信号分离器, 1:2, TSOP-6
(EN)
ALLIANCE MEMORY
芯片, SRAM, 8MB, 2.7-5.5V, 1024KX8, TSOP44
(EN)
MICROCHIP
EEPROM, 64 Kbit, 8K x 8位, 5 MHz, 并行, TSOP, 28 引脚
(EN)ADESTO TECHNOLOGIES
闪存, 32 Mbit, 8192 页 x 528字节, 20 MHz, 串行, SPI, TSOP, 28 引脚
(EN)
BSI (BRILLIANCE SEMICONDUCTOR)
芯片, SRAM, 1M, 128KX8, 2.4-5.5V, TSOP32
(EN)CYPRESS SEMICONDUCTOR
芯片, SRAM, 1Mb, 64KX16, 3V, TSOPII-44
(EN)
CYPRESS SEMICONDUCTOR
存储芯片, SRAM, 1M, 并行口, 45NS, TSOP-32
(EN)
CYPRESS SEMICONDUCTOR
芯片, 存储器, SRAM, 4MB, TSOP-44
(EN)
CYPRESS SEMICONDUCTOR
芯片, SRAM, 4Mb, 256KX16, 5V, SOJ44
(EN)CYPRESS SEMICONDUCTOR
芯片, 存储器, SRAM, 4M, 512KX8, 10NS, TSOP44
(EN)CYPRESS SEMICONDUCTOR
芯片, 存储器, FRAM, 1MB, 128KX8, 60NS, TSOP32
(EN)
HYNIX SEMICONDUCTOR
闪存, 与非, 1 Gbit, 128M x 8位, TSOP, 48 引脚
(EN)HYNIX SEMICONDUCTOR
闪存, 512 Mbit, 64M x 8位, TSOP, 48 引脚
(EN)
