TDK

多层陶瓷电容器, 表面贴装, C系列, 0.22 μF, ± 5%, C0G / NP0, 50 V, 1812 [4532 公制]

MURATA

多层陶瓷电容器, 表面贴装, 1206 [3216 公制], 4.7 μF, 16 V, ± 10%, X5R, GRM系列

VISHAY

微调电位器, 20KΩ, 25转, 10%, 通孔安装

BOURNS

金属陶瓷电阻, 5KΩ, 10+/-%容差, 7519封装

PANASONIC ELECTRONIC COMPONENTS

铝电解电容, 表面贴装, AEC-Q200 FT系列, 330 μF, 6.3 V, Radial Can - SMD, 6.3 mm, 0.26 ohm

PANASONIC ELECTRONIC COMPONENTS

铝电解电容, 表面贴装, AEC-Q200 TP系列, 100 μF, 25 V, Radial Can - SMD, 8 mm, 0.2 ohm

VISHAY

铝电解电容, 表面贴装, AEC-Q200 146 CTI系列, 220 μF, 25 V, Radial Can - SMD, 10 mm

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 100 μF, 25 V, 0.58 ohm, KZ, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 470 μF, 10 V, VT, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 22 μF, 16 V, VT, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 10 μF, 100 V, VT, V-Chip Series

VISHAY

微调电位器, 20KΩ, 25转, 10%, 通孔安装

UNITED CHEMI-CON

铝电解电容, 1000UF, 6.3V, 径向引线, CAN, 表面贴装

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 220 μF, 10 V, VT, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 330 μF, 25 V, VT, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 68 μF, 63 V, VT, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 10 μF, 80 V, VT, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 47 μF, 80 V, VT, V-Chip Series

BOURNS

微调电位器, 10 Ω, 10%, 5转, SMD

BOURNS

微调电位器, 1W, 10K

BOURNS

POT, TRIMMER, 100KOHM, 1TURN, PANEL

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 330 μF, 16 V, VT, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 150 μF, 35 V, VT, V-Chip Series

MULTICOMP

铝电解电容, 表面贴装, Radial Can - SMD, 22 μF, 63 V, VT, V-Chip Series

MULTICOMP

多层陶瓷电容器, 表面贴装, MCCA系列, 2200 pF, ± 10%, X7R, 50 V, 0603 [1608 公制]