
MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 100 μF, 25 V, VT, V-Chip Series

VISHAY
多层陶瓷电容器, 表面贴装, 2220 [5650 公制], 1000 pF, 4 kV, ± 10%, X7R, HV Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 330 μF, 16 V, KZ, V-Chip Series

MURATA
多层陶瓷电容器, 表面贴装, 0402 [1005 公制], 10 μF, 4 V, ± 20%, X5R, GRM Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 150 μF, 50 V, FZ, V-Chip Series

MURATA
多层陶瓷电容器, 表面贴装, 0603 [1608 公制], 1000 pF, 50 V, ± 1%, C0G / NP0, GRM Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 10 μF, 16 V, 2 ohm, KZ, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 22 μF, 63 V, VT, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 22 μF, 100 V, VT, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 470 μF, 10 V, VT, V-Chip Series

VISHAY
多层陶瓷电容器, 表面贴装, 2225 [5664 公制], 4700 pF, 4 kV, ± 10%, X7R, HV Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 10 μF, 80 V, VT, V-Chip Series

BOURNS
Inductor, Radial, RLB Series, 3300 μH, 170 mA, 3.7 ohm, ± 10%

VISHAY
多层陶瓷电容器, 表面贴装, 2225 [5664 公制], 1000 pF, 5 kV, ± 10%, X7R, HV Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 330 μF, 35 V, FZ, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 680 μF, 16 V, FZ, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 1000 μF, 10 V, VT, V-Chip Series

MURATA
多层陶瓷电容器, 表面贴装, 0201 [0603 公制], 0.01 μF, 6.3 V, ± 10%, X7R, GRM Series

MURATA
多层陶瓷电容器, 表面贴装, 0805 [2012 公制], 22 μF, 10 V, ± 20%, X5R, GRM Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 47 μF, 35 V, KZ, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 330 μF, 10 V, VT, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 10 μF, 16 V, VT, V-Chip Series

MULTICOMP
铝电解电容, 表面贴装, Radial Can - SMD, 470 μF, 10 V, KZ, V-Chip Series