产品分类：通信与网络模块,规格：工作温度最高值 85°C,
SILICON LABS
2级蓝牙低能量模块, 带集成片式天线和软件1.0版.
(EN)
PANASONIC ELECTRONIC COMPONENTS
蓝牙智能, VERSION4, PAN1740
(EN)
MICROCHIP
RN 42系列 2级蓝牙模块, 片上天线.
(EN)
MICROCHIP
1级蓝牙无线电模块, 带集成陶瓷射频片式天线.
(EN)
SILICON LABS
(受限产品), 蓝牙模块, WT12, IWRAP 3
(EN)
PANASONIC ELECTRONIC COMPONENTS
射频模块, 收发器, 蓝牙, CC2564, 2.4GHZ
(EN)
PANASONIC ELECTRONIC COMPONENTS
蓝牙, VERSION 4.0, 3.6V, 2.4GHZ
(EN)
CYPRESS SEMICONDUCTOR
PROC™ 模块, Bluetooth? v4.1 低能量(BLE)无线, 1MBPS, 1.8至5.5V
(EN)
PANASONIC ELECTRONIC COMPONENTS
PAN1322 Bluetooth v2.1 Classic Module
(EN)
PANASONIC ELECTRONIC COMPONENTS
射频模块, 收发器, 蓝牙, CC2541, 2.4GHZ
(EN)
LS RESEARCH
模块, TIWI-UB2, BLE 4.0
(EN)
LAIRD TECHNOLOGIES
模块, 蓝牙2.0, 1级, 内部天线
(EN)
SILICON LABS
蓝牙, VER 4.1, 2.4GHZ-2.5GHZ
(EN)
PANASONIC ELECTRONIC COMPONENTS
蓝牙, VERSION 4.1, 3.3V
(EN)
LAIRD TECHNOLOGIES
BLUETOOTH, VERSION4, 2.402-2.48GHZ
(EN)
SILICON LABS
蓝牙, VER 4.1, 2.4GHZ-2.5GHZ
(EN)
LAIRD TECHNOLOGIES
适配器, 蓝牙, USB, 1级
(EN)
MICROCHIP
蓝牙, 4.1版, 3.6V, 26MHZ
(EN)
MICROCHIP
蓝牙模块, BLE4.1, 集成MCU Cortex-M0, 2.4Ghz收发器&调制解调器, 128kB内嵌RAM
(EN)
MICROCHIP
Class 2 Bluetooth v3.0 Audio Module
(EN)
PANASONIC ELECTRONIC COMPONENTS
射频模块, 收发器, 蓝牙, CC2560A, 2.4GHZ
(EN)
MICROCHIP
Class 1 Bluetooth? v2.1 Module + EDR, SPP Profile, 2.4GHz, 3MBPS
(EN)MICROCHIP
Class 2 Bluetooth? v2.1 Module + EDR, 2.4GHz, 3MBPS
(EN)MICROCHIP
模块, 蓝牙2级, 带天线
(EN)
MICROCHIP
RN 42 Series Class 2 Bluetooth module with PCB Antenna
(EN)
