
LINEAR TECHNOLOGY
温度传感器芯片, 电压, ± 0.5°C, 0 °C, +70 °C, DIP, 8 引脚

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 电流, ± 2°C, -55 °C, +125 °C, QSOP, 16 引脚

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, SMBus, 漏极开路, ± 1°C, -40 °C, 125 °C, QSOP, 16 引脚

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 4通道, 漏极开路, -55 °C, 125 °C, μMAX, 10 引脚

PANASONIC ELECTRONIC COMPONENTS
温度传感器芯片, Grid EYE红外阵列, 数字式, ± 3°C, -20 °C, 100 °C, 模块, 14 引脚

PANASONIC ELECTRONIC COMPONENTS
压力传感器, M封装, 0至50°C, 计量器, 0 kPa, 100 kPa

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, SPI, 数字式, ± 2°C, -55 °C, 125 °C, μMAX, 8 引脚

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, SMBus 串行, 数字式, ± 5°C, -55 °C, 125 °C, QSOP, 16 引脚

PANASONIC ELECTRONIC COMPONENTS
温度传感器芯片, Grid EYE红外阵列, 数字式, ± 2.5°C, 0 °C, 80 °C, 模块, 14 引脚

SILICON LABS
温度传感器芯片, 数字式, ± 0.4°C, -40 °C, 125 °C, DFN, 6 引脚

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, I2C, 数字式, ± 2°C, -55 °C, 125 °C, QSOP, 16 引脚

MAXIM INTEGRATED PRODUCTS
温度传感器芯片, 高精密, 数字式, ± 2°C, -55 °C, 125 °C, μSOP, 8 引脚